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Kiss Slitting & Cutting Machine AKA Half-Cut Slitting Machine

  • Core Feature
    • Realizes “half-cut slitting”: Only cuts the surface layer or part of the material thickness while retaining the integrity of the bottom substrate, avoiding material breakage
    • Suitable for processing scenarios requiring substrate retention
    • Integrates multiple functions to improve equipment utilization rate
  1. Specialized Function: Foam Slitting & Cutting
    • Customized for the characteristics of foam materials (e.g., EVA foam, PU foam, pearl cotton, etc.)
    • Adopts circular knives for half-cut slitting, avoiding deformation and chipping of foam caused by cutting force
    • Post-slitting advantages: Flat surface cuts, intact bottom substrate, can be directly used for subsequent lamination and forming processes
    • Key Technical Parameters:
      • Slitting width precision: ±0.1mm
      • Supports multi-knife synchronous slitting
      • Maximum slitting speed: 150m/min
      • Adaptable foam thickness: 0.5-30mm
    • Application Fields: Processing of packaging buffer materials, automotive interior foam, shockproof foam for electronic accessories, etc.
    • Core Advantage: Multi-Function Integration